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T-962 IR OVEN/IC HEATER
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T-962C IC HEATER
T-960 REFLOW OVEN
T-835 SA INFRARED GUN
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T-8280 IR PREHEATING
DGC 939SD+
STENCILS 1
STENCILS 2
SOLDERING BALLS
REBALLING
TAPES AND FLUXES
BOARD SUPPORT
NETS
SOLDERING TIPS

T-962 DGC INFRARED IC HEATER

180×235mm Area with Digital Control

REFLOW WAVE OVEN

                                                                              Check this Video about this Oven

  

  

  

  

  

  

                  

Product Description:

The INFRARED IC HEATER T962 is a micro processor controlled reflow-oven. It can be used for effectively soldering various SMD and BGA components. The whole soldering process can be completed automatically and it is very easy to use. This machine uses a powerful infrared emission and circulation of the hot air flow, so the temperature is being kept very accurate and evenly distributed.

A windowed drawer is designed to hold the work-piece, and allows safe soldering techniques and the manipulation of SMDBGA and other small electronic parts mounted on a PCB assembly. The T962 may be used to automatically rework solder to correct bad solder joints, remove / replace bad components and complete small engineering models or prototypes.

Product Features:

★. (1) A large infrared soldering area 

Effetive soldering area: 180×235mm;this increases the usage range of this machine drastically and makes it an economical investment.

★. (2) Choice of different soldering cycles

Parameters of eight soldering cycles are pre defined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.

★. (3) Special heat up and temperature equalization with all designs

Uses up to 800 Watts of energy efficient Infrared heating and air circulation to re-flow solder.

★. (4) Ergonomic design ,practical and easily operated

Good build quality but at the same time light weight and a small footprint allows the T962 to be easily bench positioned transported or stored.

★. (5) Large number of available funtions

The T962 can solder most boss-eyed or double-face PCB boards small parts, for example CHIP,SOP,PLCC,QFP,BGA etc.It is the ideal rework solution from single runs to on-demand small batch production.

★. (6) Technical Specifications

        Maximum soldering area: 180×235mm

        Size: 31×29×17cm

        Packing Size: 36×23×36cm

        Rated Power: 800W

        ● Processing Time: 1~8min

         Power Supply: AC220V/52HZ

        Net Weight: 6.2kg

         Gross Weight: 7.5kg